基于TSV的星载微系统设计与可靠性实现

Design and reliability realization of spaceborne microsystem based on TSV

摘要:

基于硅通孔TSV（Through Silicon Vias）的星载微系统，通过硬件框架设计、TSV关键工艺设计、CPS仿真设计、全流程测试及可靠性研究，最终在全国产化高温共烧陶瓷HTCC（High-Temperature Co-fired Ceramics）管壳内集成了抗辐照海量信息处理器、抗辐照大容量存储器、抗辐照微控制器、抗辐照38译码器等器件，形成43 mm×43 mm×5.65 mm的气密性封装星载微系统，具备高可靠、高性能的处理能力以及星上常用的控制和通讯接口，可用于星上载荷信息实时处理及星务平台控制管理，可以有效替代现有的板级产品，实现星载电子系统的小型化、集成化。

Abstract:

Through hardware framework design, TSV key process design, CPS simulation design, full-process testing and reliability research based on TSV, the space-borne micro system finally integrates massive amounts of anti-irradiation information in the nationally produced HTCC shells. The processor, anti-irradiation large-capacity memory, anti-irradiation microcontroller, anti-irradiation 38 decoder and other devices form a 43 mm×43 mm×5.65 mm airtight encapsulated spaceborne micro system. This micro-system product has high-reliability, high-performance processing capabilities and common on-board control and communication interfaces. It can be used for real-time processing of on-board load information and control and management of the on-board platform. It can effectively replace existing board-level products to achieve on-board miniaturization and integration of electronic systems.