MEMS技术中的电镀工艺及其应用

Electroplating processes in MEMS technology and its application

摘要:

电镀已经成为MEMS（Micro-Electro-Mechanical System）技术中的一种重要加工手段，相比于传统意义的表面处理作用，MEMS技术中的电镀主要用于制作微结构。介绍了几种常用的以电镀为核心方法的微结构加工工艺和它们的应用领域。微结构加工工艺包括LIGA/UV-LIGA、EFAB、PolyStrata、TSV/TGV、MetalMUMPs等，结合设计好的光刻、镀膜、刻蚀等辅助微工艺技术，能够完成具有超高深宽比、多层堆叠、悬空、可动等特点的复杂三维金属微结构，并针对不同的使用需求，可以实现典型的微机械结构、惯性传感器、射频器件、异构集成、系统散热等功能应用，具有广泛的实用意义。

Abstract:

Electroplating has become an important processing method in MEMS technology. Compared with surface treatment in the traditional sense, industries electroplating in MEMS technology is mainly used to fabricate microstructures. This article introduces several common MEMS technologies with electroplating as the core process and their application fields, which include LIGA/UV-LIGA, EFAB, PolyStrata, TSV/TGV, MetalMUMPs, etc. In combination with other well-designed micro-process technologies such as photolithography, coating, and etching, the complex three-dimensional metal MEMS microstructure with the characteristics of ultra-high aspect ratio, multi-layer stacking, suspended and movable can be fabricated. For different application requirements, the typical functional applications can be realized, such as micromechanical structure, inertial sensor, RF device, heterogeneous integration and heat dissipation, which have a wide range of practical significance.