基于石墨板的电子设备大功率器件散热方法研究

Research on heat dissipation method of high power components in electronic equipment based on graphite sheet

摘要:

针对宇航电子设备大功率器件的散热路径进行了分析。对顶部散热的器件采用高导热石墨板、精确控制导热垫压缩量、增加导热路径等方式进行散热,对腹部散热的器件采用覆铜通孔等方式进行散热,并结合热仿真和温循试验,有效解决了大功率器件散热问题。

Abstract:

This paper analyzes the heat dissipation path of the high power components in aerospace electronic equipment. High thermal conductivity graphite sheet, accurately control of heat conduction pad compression and increase of heat conduction path are used for component which heat dissipation through the top. Covering the vias with copper are used for component which heat dissipates through the bottom. Combined with thermal simulation and temperature cycle test, the heat dissipation problem of high power component is effectively solved.