基于高效垂直互连的X频段三维交叉合路网络

X-band 3D composite crossover network based on efficient vertical interconnection

摘要:

针对射频微波系统小型化、一体化、低成本设计需求，利用 HFSS 软件 3D 建模仿真研究微波毫米波多层板高密度垂直互连技术，对比不同结构参数的频率特性，在结构上通过加载层间焊盘改善特定频段内传输性能，在 DC~20GHz 内回波损耗小于–20dB。基于该高效垂直互连技术，实现 32 路信号输入 4 波束输出交叉网络 3D 垂直合成， 体积仅为 125mm×30mm×1.8mm，经测试带内插损≤10.95dB，驻波比≤1.4，较好地实现了 X 频段合路输出功能。

Abstract:

Aiming at the miniaturization, integration and inexpensive design requirements of RF microwave system, the high-density vertical interconnection technology of microwave millimeter wave multi-layer board is studied by HFSS software 3D modeling and simulation. The frequency characteristics of different structural parameters are compared, and the transmission performance in some frequency bands is improved by adding interlayer pads. The S11 is less than –20dB in DC~20GHz. Based on the high-efficiency vertical interconnection technology, 3D vertical synthesis of 32-channel input 4-beam output crossover network is realized. Component network volume is only 125mm×30mm×1.8mm, the S21≤–10.95dB, VSWR≤1.4. It’s better to realize the X-band composite output function.